DBC substrate-3

As a new and high capability substrate, DBC substrates have been used widely in electric power and electronic industry.
The high thermal conductivity of Al2O3 (24W/mK) and AIN(180W/mK) combined with the high thermal capability of thick
high purity copper(typically 0.2mm or 0.3mm thick copper) make DBC the most popular material choice for power chip on board assemblies.
1.excellent mechanical strength
2.excellent electrical insulation
3.very good thermal conductivity
4.superb thermal cycling stability
5.the thermal expansion coefficient is close to that of silicon
6.maybe structure just like PCB or "IMS" substrates
7.enviromentally clean

DBC substrate-3